Why Clean No Clean?

摘要

Cleaning, total production costs, product climatic reliability and final product quality in our industry are all closely interrelated. A strong case can be made for the cleaning of PCBs manufactred with the so-called "No-Clean" solder pastes, (which should really be classified as low residue solder pastes). Cleaning is especially important for high-end boards in industries such as aerospace, automotive, high-end computing, medical and telecommunications for reliability and quality purposes. However, we feel the case can be made, especially with the ever increasing occurrence of high frequency boards, that cleaning is not an option, but a necessity in high reliability applications. Cleaning is the only reliable method to ensure the climatic reliability and therefore proper product functional quality that may be compromised due to dendrite growth and parasite capacitance that can result from activator resi lues found on the surface. The climatic reliability of boards containing silver in new lead free alloys appearing on the market also warrant investigation in order to avoid problems seen in the past.