Heat Transfer and Handling of Media in Newly Developed Vapour Phase Soldering Systems

摘要

In vapour phase processes there is a very efficient heat transfer to components, solder and boards at the same time. The soldering temperature can be safely controlled. Unfortunately, however, there are some problems with respect to the rather complicated transport system and in designing an effective te mperature profile. They can be overcome by a new concept developed in a joint project between FNE Research In Institute for Nonferrous Metals in Freiberg, IZM Fraunhofer Institute in Berlin, Rehm Anlagenbau in Blaubeuren and the Technical University in Hamburg-Harburg. Most important it is a real in-line-system with horizontal transport. Some information is given about the special heat transfer situation and about the handling of media. Especially with mixtures as working fluids special techniques for fluid recovery are needed. New distillation technologies were applied and the problem of contamination of the media could thus be solved. Based on these results there may emerge a new generation of vapour phase soldering machines.