SMD Placement Machine Concept Characterization

摘要

1. Machine concepts where the PCB is not moving during placements are in favor due to: 1.1. Potentially better placement accuracy (no accelerations acting on pre-mounted components). It is expected that placement accuracy will become a more decisive factor in the near future due to increasing miniaturization in electronic products. 1.2. Higher output attainable. There are no limitations due to possible shift of pre-mounted comporents on the PCB. Machine concepts matching this requirement are: 1.3. Single gantry concepts 1.4. Dual gantry concepts 1.5. Collect and Place concept 1.6. Multiple Pick and Place concept (MPP) 2. Machine concepts with a modular structure offer best match between reeded output and necessary investments. Also low-cost machines with limited output (e.g. single gantry / dual gantry concepts) offer this modularity. In the latter case this can lead to a large number of placement machines in line, leading to large floorspace and more operators required. Therefor the MPP concept is best suited for lowest CoP (> 35000 cph). Modular machine concepts also offer highest machine avai ability. 3. Machines with single sided feeding and operation at the same side are in favor due to minimum line floor space requirements and operators needed. 4. In an optimal machine concept good attention is taken for optimization of the output: 4.1 Minimum travel distances 4.2 Auxiliary actions (like PCB run-in/run-out, vision) are performed in parallel with placement actijns, thus requiring no additional cycle time. 4.3 Nozzle flexibility 4.4 Fast changeover concepts (minimum downtime!), like feeder trolleys and no PCB specific tooling required. 5. Modular machine concepts offer best upgradability opportunities for the future.