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Automated SPC for the Reflow Process

机译:自动化SPC用于回流过程

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This paper will discuss the implementation of real-time automated SPC for the Reflow Process. Topics covered will include: a new statistical method for quantifying the thermal process performance; methods for ensuring that SPC data provides a true representation of process capability; and the value of automated real-time SPC. To realize the full benefit of an SPC program, it is essential to define and set process specific control limits. SPC programs based on "targets" rather than process specific control limits are not capable of reliably predicting process trends, which is the primary function of an SPC program. Developing a fully functional SPC program requires a sufficient data set on which to project process trends. Another key factor in the success of an SPC program is efficiency. An inefficient method of data gathering and analysis is a guarantee of failure, as a program that consumes excess resources will quickly be abandoned. One method for increasing SPC program efficiency is to focus on key process statistics. A statistical method has been developed hat reduces all key process statistics to a single number: the Process Window Index. The calculation of the process Window Index will be defined and its validity as a statistical method for developing Cp and Cpk for the reflow process established. The continuous and automated gathering of data is essential for successful SPC monitoring of the reflow process. Current methods generally rely on periodic profiling, which disrupts production and provides an inaccurate "picture" of the process. Automated Continuous Monitoring Systems for the reflow process have been developed. These systems can provide a data point for every board processed by calculating a "Virtual Profile". A design of experiment (DOE) will be run to establish that the "Virtual Profile" is a leliable method of continuously gathering data on the reflow process. Experiment methods and results will be included. Automated SPC for the reflow process offers significant benefits for Electronics Assemblers. Automated SPC provides a significant sales tool for EMS's, as it allows them to prove to customers that their reflow process is in control and that their facility is dedicated to quality electronics assembly. This paper will be of interest to engineers and managers interested in increasing reflow process efficiency and quality.
机译:本文将讨论对回流过程的实时自动化SPC的实现。涵盖的主题包括:一种用于量化热处理性能的新统计方法;确保SPC数据提供过程能力的真实表示的方法;以及自动实时SPC的值。为了实现SPC程序的全部好处,必须定义和设置处理特定的控制限制。基于“目标”而不是处理特定控制限制的SPC程序不能可靠地预测过程趋势,这是SPC程序的主要功能。开发一个全功能的SPC程序需要足够的数据集,以项目流程趋势。 SPC程序成功的另一个关键因素是效率。数据收集和分析的低效方法是失败的保证,作为消耗超过资源的程序将很快被抛弃。一种增加SPC程序效率的方法是专注于关键过程统计。已开发统计方法帽将所有关键过程统计数据减少到单个数字:进程窗口索引。将定义过程窗口索引的计算及其作为建立回流过程的CP和CPK的统计方法的有效性。数据的连续和自动收集对于成功的SPC监控来说是必不可少的。目前的方法通常依赖于周期性分析,这些分析破坏了生产并提供了该过程的不准确的“图片”。已经开发了用于回流过程的自动连续监控系统。这些系统可以通过计算“虚拟简档”来为每个板提供数据点。实验(DOE)的设计将被运行以确定“虚拟简介”是一种可携带回流过程中数据的可靠方法。实验方法和结果将包括在内。用于回流工艺的自动化SPC为电子装配机提供了显着的优势。自动化SPC为EMS提供了一个重要的销售工具,因为它允许他们向客户证明他们的回流过程控制,并且他们的设施致力于优质的电子设备。本文对有兴趣的工程师和管理人员感兴趣,感兴趣地增加回流过程效率和质量。

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