CHARACTERIZATIONS OF ELECTRODEPOSITED COPPER SURFACE IN THE PRESENCE OF COMPOSITE SURFACTANTS

摘要

The surface of electrodeposited copper at the current density of 270 A·m~(-2) effected with the different combination of surfactants has been evaluated experimentally. Being incorporated with gelatin and thiourea, the surfactants which are approached for this concern include Abitone A, thiosemicarbazide, polyethylene glycol, allyl-thiourea, polyvinyl alcohol, sodium laurylsulfonate and sodium dodecylsulfate varying with different amount. A combination of Abitone A, allyl-thiourea, sodium laurylsulfonate and sodium dodecylsulfate is found more satisfactory to achieve the fined grain structure resulting in leveling and brightening on cathodic copper surface.