The PC 3000 was especially developed for an application in the automotive area. On substrates like Al{sub}2O{sub}3 or LTCC and different thickfilm metallisation like AgPd, AgPt, or Au, this glue builds the contact between the SMT component or bare die and the metallisation. One reason for glueing different com-ponents, is the low thermal stability of some of them, which is < 150°C.The small evaporation of the PC 3000 allows to set the wire bonds in a very short distance to the dies, so that smaller substrat area's are usable. With the good properties of PC 3000 it is possible to build up circuits for different applications.
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