MICROELECTRONICS ASSEMBLY INNOVTIONS, BASED ON CAPILLARY CONNECTION(C2), FOR ASSEMBLY

摘要

Modern progress of semiconductor industry significantly depends on limitations of VLSI packaging technology. New expectation from "bumpless build- up layers" (BBUL) technology which have synergy with Si front end makes an impression, that assembly fabs will not have such a powerful technology in the back- end. This paper demonstrates, that Universal Contact Unit (UCU) or Capillary Connection (C2)-tee1inology can be a powerful substitute for WB (for peripheral pad chips) and C4 (area array chips) technologies for assembly fabs (because of finer pitch, better speed and Large Area processing capabilities), as well as appropriate competitor for BBUL assembly inside silicon fabs.