首页> 外文会议>European Microelectronics Packaging Interconnection Symposium >INVESTIGATIONS OF THE INFLUENCE OF Au-ALLOY ADDITIVES ON DIMINISHING Au-Al JOINTS DEGRADATION
【24h】

INVESTIGATIONS OF THE INFLUENCE OF Au-ALLOY ADDITIVES ON DIMINISHING Au-Al JOINTS DEGRADATION

机译:Au-合金添加剂对Au-Al关节降解降低的影响的研究

获取原文
获取外文期刊封面目录资料

摘要

The paper describes investigations of the dependence of resistance and strength properties of Au -Al joints on the kind of additive to gold and the ageing time at 200°C. Gold was doped with Ag, Cu, Pd or Pt additives. The ageing process caused intermetallic compounds formation at the border between Al wire and Au alloy substrate. The effect of intermetallic phases growth was analysed by metallographic and SEM/EDX examinations. The great resistance increase was observed in the case of pure Au or Pt doped substrates. The strongest joints were obtained on Au doped with Cu or Pd while the lowest resistance was reached for Ag doping. Ag, Cu or Pd additive to Au clearly inhibited Au -Al joint failure due to reactions taking place in the phase transformation zone.
机译:本文描述了抗性和强度特性对黄金添加剂的抗性和强度特性的研究和200℃的老化时间。黄金掺杂有Ag,Cu,Pd或Pt添加剂。老化过程在Al线和Au合金基材之间的边界处形成金属间化合物。通过金相和SEM / EDX检查分析了金属间相阶段生长的影响。在纯AU或PT掺杂基材的情况下观察到耐受耐受巨大抗性增加。在掺杂有Cu或Pd的Au上获得最强的关节,而Ag掺杂达到最低抗性。 Ag,Au的Ag,Cu或Pd添加剂显然抑制了由于在相变区中发生的反应而导致的Au-al关节衰竭。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号