Electroless (EL) processes have been explored for multiple applications in chip manufacturing over last decade. This paper presents the application of EL Ni for via fill. The inherent seam and void in traditional TiN/W processes for high-aspect-ratio vias pose reliability issues. The approach discussed in this article demonstrates that EL Ni is a feasible alternative to TiN/W for high-aspect-ratio vias. The EL Ni fill provides a void- and seam-free fill; it also presents some unique challenges.
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机译：已经探索了电解（EL）流程在过去十年中的芯片制造中的多种应用。本文介绍了EL NI的应用。具有传统锡/ W的固有接缝和空隙，用于高纵横比的过程通过姿势可靠性问题。本文讨论的方法表明EL NI是对高纵横比通孔的可行替代方案。 EL NI填充提供无缝和无缝填充物;它还具有一些独特的挑战。
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