The rapid growth of microelectronic industry is leading to the much requirement for packaging technology in China in recent years. Now the government pays more attention to the development of packaging technology. This paper reviews the recent research works on the electronic packaging materials and technology in Tsinghua University. In the area of electronic packaging materials, many alloys, such as the lead frame materials, as well as a series of substrate materials, such as low-temperature cofired ceramics (LTCC) and the insulated metal substrates have been developed. In the area of electronic packaging technology, the technology of flip chip bump fabrication has been studied.
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