Embedded Capacitor Formed on PWB for Next Generation Package

摘要

There are several methods to form capacitors into an organic package. Generally following methods tend to be used, high DK materials are directly coated onto inner layers using screen printing during on the way of package fabrication process or actual chip capacitors or some bulks such as silicon and metal previously formed with capacitors by tough sputtering process are buried into package body. However former method can not satisfy a specification of semiconductor package in the value, later method has problem with their handing or set position accuracy. To solve their problems, anodizing to change to oxidation with high DK metal such as Ta, a capacitor with high value and accurate position was developed. The capacitors can be formed on any layers and at any position where are needed in electrical design at low cost because sputtering condition to deposit the metals and Anodizing are gentle without any damage to organic materials.