Wireless communications includes a broad spectrum of mobile and fixed products. Mobile systems range from products such as handsets (cellular phones, PDAs, and radios) to global positioning systems. Fixed wireless communications products include personal area networks (WPAs, Bluetooth, Home RF), local area networks (WANs), and broadband wireless access (BWA, MMDS, LMDS, Sat-based). Portable and handheld systems are driving the volumes for IC shipments. Enabling the introduction of small form factor wireless products are new developments in semiconductor packaging and assembly. This presentation will describe packaging developments and trends in mobile products, including baseband, RF, IF, and Bluetooth modules. Chip scale packages (CSPs) as well as packages that can handle high frequency are discussed. Attention is given to trends in low-cost packaging.
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