Device Packaging in the Year 2020!

摘要

Microelectronics packaging provides the technological base for most if not all future device packaging, whether electronic, optical/photonic, sensor, MEMS or biological in nature. The glimpse into the future provided in this paper demonstrates both the dramatic changes to be wrought and the ready availability of many technologies for solving the many specialized problems raised by these new device types. Beginning with a review of today's state of the art packaging materials, processes and structures this paper presents one perspective on device packaging in the first quarter of the twenty first century!