3D Interconnects at Wafer Level by Wafer Bonding

摘要

A new alignment technique is proposed for wafer level 3D interconnects fabrication: the SmartView. This original procedure is using alignment keys located in the bonding interface and can ensure an alignment precision of 1 μm. After the alignment procedure the wafers are secured for subsequent wafer bonding procedures. The alignment process is presented in detail, as well as the integration of such an equipment in high production systems able to run wafers up to 300 mm diameter.