首页> 外文会议>Annual International Conference on Composites Engineering >METAL LAYER DEPOSITED BY REDUCTION OF METAL IONS CONTAINED IN POLYMER FOR MAGNETIC AND ELECTRICAL MATERIAL
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METAL LAYER DEPOSITED BY REDUCTION OF METAL IONS CONTAINED IN POLYMER FOR MAGNETIC AND ELECTRICAL MATERIAL

机译:通过用于磁性和电气材料的聚合物中包含的金属离子还原的金属层

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Surface-metallized polymer film is widely applicable material for electronic devices. Well-known methods for the metallization of a material surface are electroless plating, vacuum evapolation and coating. Here we introduce a simple and easy method for metallization of polymer surface and magnetic and electric properties of the polymer are reported. Previously, we found that the surface of a polymer containing metal ion could easily be metallized by reducing in an aqueous solution of NaBH_(4). In this method, polyacrylonitrile (PAN) and poly(vinylidene fluoride) (PVdF) can be successfully used as polymer matrix. We review the electric and magnetic properties of the polymermetal composite, and its potential for electro-magnetic interference (EMI) shielding.
机译:表面金属化聚合物薄膜是电子设备的广泛适用材料。用于金属化材料表面的众所周知的方法是无电镀,真空蒸发和涂层。在这里,我们引入了一种简单且简单的聚合物表面金属化方法,并报道了聚合物的磁性和电性能。以前,我们发现含有金属离子的聚合物的表面可以通过在NaBH_(4)的水溶液中来容易地金属化。在该方法中,聚丙烯腈(盘)和聚(偏二氟乙烯)(PVDF)可以成功用作聚合物基质。我们审查了多种复合材料的电和磁性,以及其电磁干扰(EMI)屏蔽的电位。

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