Computational and experimental study of thermal management in a new design of a transceiver for high speed Internet applications

摘要

Demand for greater data rates, due to rapid growth of network and Internet traffic, has pushed the limits of the existing hardware and drives the development of new data handling hardware. In this paper, we describe one of the next generation I/O devices and address some of the issues relating to its thermal management. This is done by developing a FEM model to simulate thermal behavior of the device under a variety of operating conditions, presenting results of the simulation, and performing selected experimental measurements of the device to validate the FEM model.