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Temperature Dependent Empirical Modeling of Proximity Diffused Si Esaki Diodes and Memory Circuits

机译:近距离的温度依赖性经验模型扩散Si Esaki二极管和存储器电路

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Field effect transistor circuits augmented with tunnel diodes lead to decreased circuit footprints, improved operating speeds, and lower power consumption. Low power refresh-free tunneling-SRAM (TSRAM) [1] and high performance compact A/D converters [2] were realized with III-V compound semiconductors. Current advances in Si-based tunnel diodes, such as Si/SiGe resonant interband tunnel diode (RITD) structures [3], create opportunities for Si-based tunnel diode circuits. Recently, monolithically integrated TSRAM cells demonstrate the compatibility of Si/SiGe RITDs with traditional Si CMOS technology [5]. However, without SPICE compatible models it is difficult to design, characterize, and understand the functionality of complex circuits. Past models include piece-wise polynomials [5], complex arrangements of discrete device components [6], physics based models [7], and trigonometric curve fits [8,9]. These models have discontinuities, kinks in their slopes, difficult parameters to extract, unknown parameters, no closed form solutions, and poor fits to measured data. In this abstract, the authors report on a modified version of the Sze model [9] with a superior match to experimental data, for Si based Esaki tunnel diodes (ETD).
机译:使用隧道二极管增强的场效应晶体管电路导致电路占地面积降低,改善的操作速度和更低的功耗。使用III-V复合半导体实现低功率刷新隧道-SRAM(TSRAM)[1]和高性能小型A / D转换器[2]。基于Si的隧道二极管的电流前进,如Si / SiGe谐振间隧道二极管(RITD)结构[3],为基于SI的隧道二极管电路创造机会。最近,单片集成的TSRAM细胞证明了Si / SiGe ritds与传统的Si CMOS技术的相容性[5]。但是,如果没有SPICE兼容模型,很难设计,表征和理解复杂电路的功能。过去的模型包括分型多项式[5],分立装置组件的复杂布置[6],基于物理的模型[7],以及三角曲线适合[8,9]。这些模型具有不连续性,扭结在斜坡上,提取困难的参数,未知的参数,无闭合形式解决方案,并且较差的符合测量数据。在此摘要中,作者报告了Si基于Easaki隧道二极管(ETD)的SIE与实验数据的SZE模型[9]的修改版本。

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