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Controlled Localized Heating on Integrated Circuits for Cold-Ambient Temperature Applications

机译:用于冷环境温度应用的集成电路上的控制局部加热

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From space to automotive applications, electronics needs to operate in a wider range of thermal environments. Since device parameters such as mobility and intrinsic carrier concentration depend on temperature, circuit designers need to be aware of the precise thermal operating conditions, to ensure that performance variations are within acceptable limits. Furthermore, certain applications may demand active temperature control. Circuits designed for cryogenic ambient temperature operation are sometimes externally heated, while the self-heating problems of processors with high device density and operating frequencies may require cooling. Along with the temperature-dependent device behavior, this also requires detailed understanding of heat generation and dissipation in integrated circuits.
机译:从空间到汽车应用,电子设备需要在更广泛的热环境中运行。由于诸如移动性和内在载流子浓度的设备参数取决于温度,因此电路设计人员需要了解精确的热操作条件,以确保性能变化是可接受的限制。此外,某些应用可能需要有效的温度控制。设计用于低温环境温度操作的电路有时是外部加热的,而具有高器件密度和操作频率的处理器的自我加热问题可能需要冷却。随着温度依赖的装置行为,这还需要详细了解集成电路中的发热和耗散。

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