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Modeling the Effect of Technology Trends on the Soft Error Rate of Combinational Logic

机译:建模技术趋势对组合逻辑软误差率的影响

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This paper examines the effect of technology scaling and microarchitectural trends on the rate of soft errors in CMOS memory and logic circuits. We describe and validate an end-to-end model that enables us to compute the soft error rates (SER) for existing and future microprocessor-style designs. The model captures the effects of two important masking phenomena, electrical masking and latching-window masking, which inhibit soft errors in combinational logic. We quantify the SER due to high-energy neutrons in SRAM cells, latches, and logic circuits for feature sizes from 600nm to 50nm and clock periods from 16 to 6 fan-out-of-4 inverter delays. Our model predicts that the SER per chip of logic circuits will increase nine orders of magnitude from 1992 to 2011 and at that point will be comparable to the SER per chip of unprotected memory elements. Our result emphasizes that computer system designers must address the risks of soft errors in logic circuits for future designs.
机译:本文研究了技术缩放和微体系结构趋势对CMOS存储器和逻辑电路的软误差速度的影响。我们描述并验证了一个端到端模型,使我们能够计算现有和未来的微处理器风格设计的软错误率(SER)。该模型捕获了两个重要掩蔽现象,电掩模和锁定窗口掩蔽的效果,这抑制了组合逻辑中的软误差。我们由于SRAM电池,闩锁和逻辑电路中的高能中子而定量了SER,用于特征尺寸从600nm到50nm,时钟周期从16到6个粉丝超出4个逆变器延迟。我们的模型预测,逻辑电路的每个芯片SER将从1992年到2011年增加九个数量级,并且在该点将与未受保护内存元件的SER相当。我们的结果强调,计算机系统设计人员必须解决逻辑电路中软错误的风险,以备将来的设计。

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