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Synthesis of III-N_x-V_(1-x) Thin Films by N Ion Implantation

机译:N离子注入的III-N_X-V_(1-X)薄膜的合成

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Dilute III-N_x-V_(1-x) alloys were successfully synthesized by nitrogen implantation in GaAs and InP. The fundamental band gap energy for the ion beam synthesized III-N_x-V_(1-x) alloys was found to decrease with increasing N implantation dose in a manner similar to that commonly observed in epitaxially grown GaN_xAs_(1-x) and InN_xP_(1-x) thin films. The fraction of N occupying anion sites ("active" N) in the GaN_xAs_(1-x) layers formed by N implantation was thermally unstable and decreased with increasing annealing temperature. In contrast, thermally stable InN_xP_(1-x) alloys with N mole fraction as high as 0.012 were synthesized by N implantation in InP. Moreover, the N activation efficiency in InP was at least a factor of two higher than in GaAs under similar processing conditions. The low N activation efficiency (<20%) in GaAs can be improved by co-implanting Ga and N in GaAs.
机译:通过GaAs和InP中的氮气植入成功地合成稀III-N_X-V_(1-X)合金。离子束合成III-N_X-V_(1-X)合金的基波带隙能量被发现随着N个植入剂量的方式而降低,其与在外延生长的GaN_AS_(1-x)和Inn_xp_( 1-x)薄膜。在N植入形成的GaN_AS_(1-X)层中的N占领阴离子位点的级分(“活性”N)热不稳定并且随着退火温度的增加而降低。相反,通过INP的N植入合成具有高达0.012的N摩尔分数的热稳定的INN_XP_(1-X)合金。此外,在类似的加工条件下,INP中的N激活效率比GaAs高至少两个。通过在GaAs中植入Ga和N,可以改善GaAs中的低N激活效率(<20%)。

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