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Cluster'contact epitaxy'-direct evidence for novel particle: substrate interactions

机译:Cluster Contact Epitaxy'-Direct用于新型粒子的证据:底物相互作用

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In this paper we describe observations of novel interactions between clusters of Ag deposited on the clean (001) Cu surface. The experiments are analogous to those performed by Gleiter and co-workers in the 1970's, where grain boundary orientations in particles of Cu and Ag supported on single crystal metal substrates were studied. Upon annealing close to the melting point, these particles (approx10-100 mu m in diameter) were found to rotate on the surface, forming low-energy grain boundary configurations with the substrate. The particles studied in our experiments are approx10~4 times smaller, and show rather different behavior. In the case of Ag nanoparticles we have observed a novel phenomenon, which we call 'contact epitaxy', involving the formation of several monolayers of epitaxially oriented Ag at the Cu surface upon contact between this surface and the Ag cluster. The phenomenon may be understood from molecular dynamics simulations of the 'soft impact' betweent he nanoparticle and surface, which indicate that the ordered layers form within picoseconds of contact. We will discuss the mechanisms by which 'contact epitaxy' is believed to occur.
机译:在本文中,我们描述了在清洁(001)Cu表面上沉积的Ag簇之间的新型相互作用的观察。实验类似于由凝胶剂和20世纪70年代的共同工作者进行的实验,其中研究了在单晶金属衬底上负载的Cu和Ag颗粒中的晶界取向。在靠近熔点的退火时,发现这些颗粒(直径大约10-100μmm)在表面上旋转,形成与基板的低能量晶界构造。在我们的实验中研究的颗粒较小约为10〜4倍,并且显示出相当不同的行为。在Ag纳米颗粒的情况下,我们观察到一种新的现象,我们称之为“接触外延”,涉及在该表面和Ag簇之间接触时形成在Cu表面上的几种外延取向的Ag的单层。可以从纳米粒子和表面之间的“软撞击”的分子动力学模拟中可以理解该现象,这表明有序层在皮秒内形成的接触。我们将讨论据信“联系外延”发生的机制。

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