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Mechanical Characterization of Interfacial Adhesion in Elastomeric Material for Microelectronic Device through JKR Model Combined with Micro-to-Nano IIT

机译:通过JKR模型结合微电胞微电子器件弹性材料界面粘附的机械表征。

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Instrumented indentation testing (IIT) is a very useful technology for the mechanical characterization of materials. However, existing IIT techniques, which are based on the Hertz model and were developed for hard materials with negligible surface adhesion such as metals and ceramics, are difficult to directly apply to compliant materials such as elastomeric polymers which have viscoelastic hysteresis due to infinitesimal surface/interfacial adhesion. Here we employed some modified model to evaluate the work of adhesion in elastomeric polymer from our previous work, and reinforced our theory and algorithm through empirical approaches so as to consider the time-dependency of viscoelastic material as testing parameter. To do these all, we combined analytic JKR theory and conventional IIT technology to analyze the physical meaning of the theory and then verified our ideas experimentally with elastomeric polymer, PDMS (poly(dimethyl-siloxane)), of various compositions. Our algorithm was developed and verified on a microinstrumented indentation basis and extended even into the nanoinstrumented testing for the micro/nano-scaled applications.
机译:仪表压痕测试(IIT)是一种非常有用的材料,用于材料的机械表征。然而,基于Hertz模型的现有IIT技术并为具有可忽略的表面粘附等诸如金属和陶瓷的硬质材料而开发,难以直接适用于柔顺的材料,例如由于无限的表面的粘弹性滞后(具有粘弹性滞后)界面粘附。在这里,我们采用了一些修改模型来评估我们以前的工作中的弹性体聚合物中粘附的作品,并通过经验方法加强了我们的理论和算法,以便考虑粘弹性材料作为测试参数的时间依赖性。要做这些全部,我们组合分析JKR理论和常规IIT技术分析理论的物理含义,然后用各种组合物的弹性聚合物,PDMS(聚(二甲基 - 硅氧烷))实验验证了我们的思想。我们的算法在微量齿形压痕上开发并验证,甚至延长了微/纳米缩放应用的纳米仪测试。

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