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Nitrogen Passivation of the Interface States Near the Conduction Band Edge in 4H-Silicon Carbide

机译:界面状态在4H-碳化硅中导通带边缘附近的界面钝化

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This paper describes the development of a nitrogen-based passivation technique for interface states near the conduction band edge [D_(it)(E_c)] in 4H-SiC/SiO_2. These states have been observed and characterized in several laboratories for n- and p-SiC since their existence was first proposed by Schorner, et a. [1]. The origin of these states remains a point of discussion, but there is now general agreement that these states are largely responsible for the lower channel mobilities that are reported for n-channel, inversion mode 4H-SiC MOSFETs. Over the past year, much attention has been focused on finding methods by which these states can be passivated. The nitrogen passivation process that is described herein is based on post-oxidation, high temperature anneals in nitric oxide. An NO anneal at atmospheric pressure, 1175 deg C and 200-400sccm for 2hr reduces the interface state density at E_c-E approx= 0.1eV in n-4H-SiC by more than one order of magnitude - from > 3X 10~(13) to approximately 2 X 10(12) cm~(-2) eV~(-1). Measurements for passivated MOSFETs yield effective channel mobilities of approximately 30-35cm~2/V-s and low field mobilities of around 100cm~2/V-s. These mobilities are the highest yet reported for MOSFETs fabricated with thermal oxides on standard 4H-SiC and represent a significant improvement compared to the single digit mobilities commonly reported for 4H inversion mode devices. The reduction in the interface state density is associated with the passivation of carbon cluster states that have energies near the conduction band edge. However, attempts to optimize the the passivation process for both dry and wet thermal oxides do not appear to reduce D_(it)(E_c) below about 2 X 10~(12)cm~(-2)eV~(-1) (compared to approximately 10~(10)cm~(-2)eV~(-1) for passivated Si/SiO_2). This may be an indication that two types of interface states exist in the upper half of the SiC band gap - one type that is amenable to passivation by nitrogen and one that is not. Following NO passivation, the average breakdown field for dry oxides on p-4H-SiC is higher than the average field for wet oxides (7.6MV/cm compared to 7.1MV/cm at room temperature). However, both breakdown fields are lower than the average value of 8.2MV/cm measured for wet oxide layers that were not passivated. The lower breakdown fields can be attributed to donor-like states that appear ear the valence band edge during passivation.
机译:本文介绍了在4H-SIC / SIO_2中导通带边缘[D_(E_C)]附近的接口状态的氮基钝化技术的开发。已经观察到这些状态,并且在若干实验室的若干实验室,因为他们的存在是Schorner等的第一次提出。 [1]。这些国家的起源仍然是一个讨论的点,但现在普遍认为,这些国家的普遍负责对N频道,反转模式4H-SIC MOSFET报告的较低信道迁移行为。在过去的一年中,很多关注都集中在找到这些国家可以被钝化的方法。本文所述的氮钝化过程基于氧化后,高温退火在一氧化氮中。在大气压下,1175℃和200-400SCCM在2小时内的1175℃和200-400SCCM在e_c-e上的界面状态密度在n-4h-sic中的大约0.1ev,从> 3x 10〜(13 )至约2×10(12)cm〜(-2)eV〜(-1)。钝化MOSFET的测量结果产生约30-35cm〜2 / V-s的有效通道迁移率,并且低近场迁移率约为100cm〜2 / V-s。这些迁移率最高,尚未报道,用于标准4H-SIC的热氧化物制造的MOSFET,与常用于4H反转模式装置的单位数迁移率相比,表示显着改进。界面状态密度的减小与具有在导通带边缘附近的能量的碳簇状态的钝化相关联。然而,试图优化干燥和湿热氧化物的钝化过程,不会降低约2×10〜(12)cm〜(-2)EV〜( - 1)(与钝化的Si / SiO_2的大约10〜(10 )cm〜(-2)eV〜(-1)相比)。这可能是迹象表明,在SiC带隙的上半部存在两种类型的界面状态 - 一种易于通过氮的钝化和不是的类型。在没有钝化之后,P-4H-SiC的干氧化物的平均分解场高于湿氧化物的平均场(7.6mV / cm,与室温为7.1mV / cm)。然而,对于未被钝化的湿氧化物层测量,两个击穿字段低于测量的平均值8.2mV / cm。下的击穿电场可以归因于该钝化过程中出现耳部的价带边缘类施主态。

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