Further developments in gold plating technology for microelectronics

摘要

This paper will outline the status of Gold Plating Technology in Microelectronics, in particular, Pure Gold, and the technical requirements in terms of physical properties required for specific applications such as Bondable Pure Gold for BGA application. Current practice in BGA technology will be outlined and some practical guidelines for Process Control will be explored. Comparisons will be drawn between Acid Hard Gold and Pure Gold technology, in terms of contamination resistance, and the impact of such contaminants on the final deposit composition achieved, related to defined specifications.