The Effects of Process and Metallurgical Variables Upon Black Film Formation in Acid Copper Electroplating Using Phosphorized Copper Anodes

摘要

Phosphorus containing copper anodes and chloride additions in the plating bath are employed to cause the formation of a black "protective" film on the anode surfaces during electroplating. This protective film reduces anode sludging and improves the quality and efficiency of the plating process. This paper describes tests done to characterize the best process window to optimize black film formation. Variables evaluated include phosphorus content of anodes, chloride content of the bath, and anode current density. Anode variables explored include anode purity, grain structure, and work hardening. "Best operating practice" recommendations concering these variables are suggested for the plater.