New positive-type photosensitive poly(phenylene ether):1.poly(2-hydroxy-6-methylphenol-co-2,6-dimethylphenol) with diazonaphthoquinone

摘要

Photosensitive polyimides (PSPIs) are widely used as protection and insulation layers of very large scale integration circuit (VLSI),multi-chips modules for computers,telecommunications and thermal-heads because they simplify processing and do not need a photoresist used in the microlithography and a toxic etchant such as hydrazine.