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Chemical perspectives on growth and properties of ultrathin SiO_2 layers

机译:超薄SiO_2层生长和性质的化学视角

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We have performed extended quantum mechanical calculations to study the energy required to cleave the Si - Si bond when one silicon is bonded to hydrogen (and thus mimics elemental silicon) and the other is bonded to electronegative groups. We have observed that when the silicon is bonded to OH groups the water-assisted heterolytic cleavage becomes progressively easier the higher is the number of OH terminations. These considerations are extended to bulk silica (to calculate the cleavage energy of the oxygen vacancy) and to the surface of oxidized silicon (to study the possible dissociation modes).
机译:我们已经进行了扩展的量子力学计算,以研究将一个硅粘合到氢气(因此模拟元素硅)粘合时切割Si-Si键所所需的能量,而另一硅粘合到电负剂基团。我们观察到,当硅粘合到OH基团时,水辅助的异解裂解变得逐渐变得更容易,oh终端的数量越高。这些考虑因素延伸到散装二氧化硅(计算氧空位的切割能量)和氧化硅的表面(研究可能的解离模式)。

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