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Field emission from tetrahedrally bonded amorphous carbon as a function of surface treatment and contact material

机译:从四面体键合无定形碳的场发射作为表面处理和接触材料的函数

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In order to test whether field emission from tetrahedrally bonded amorphous (ta-C) is affected by the back contact material we have carried out a series of emission experiments on Filtered Cathodic Vacuum Arc (FCVA) produced ta-C films. The measurements were made on identical films of approximately 25 nm thickness which have been grown simultaneously on various substrates of different work function. For these experiments the substrates used were p-type c-Si, n-type c-Si, SnO_2, tungsten, gold, lead, aluminium, molybdenum, chromium and titanium. Threshold fields for emission were generally in the range of 5 -15 V/micron and showed no direct dependence on back contact material work function. Films grown on Ti and W however had much higher threshold fields in the range 30-35 V/micron and this is thought to be associated with the native oxide which was present between the back contact and the ta-C film. As grown ta-C is also known tohave a 1-2 nm thick sp~2 rich layer on its surface and this layer may also have some effect on field emission. The layer was etched in either an O_2 or H_2 plasma and both etched surfaces led to improved emission efficiency.
机译:为了产生TA-C膜测试场发射从四面体键合非晶(TA-C)是否是由我们进行了一系列的实验发射上过滤阴极真空电弧(FCVA)背接触材料的影响。该测量是在其上已经同时生长在不同的功函数的各种基材大约25纳米厚的相同的膜制成。对于这些实验中使用的底物是p型晶体硅,n型晶体硅,SnO_2,钨,金,铅,铝,钼,铬和钛。用于发射阈值字段一般是在5 -15 V /微米的范围内,显示出对背接触材料的功函数没有直接的相关性。然而生长对Ti和W薄膜具有高得多的阈值的字段范围为30-35伏特/微米,这被认为是具有天然氧化物这是在背接触和ta-C膜之间存在相关联。作为生长TA-C也被称为有机会上其表面上具有1-2纳米厚的SP〜2富集层和该层也可对场发射一定效果。所述层是在任一种O_2或H_2等离子体,并导致改进的发光效率都蚀刻表面蚀刻。

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