首页> 外文会议>Semiconductor Equipment and Materials International packaging seminar >Reducing product cycle time in semiconductor assembly: Market Pressures and Strategy for Success
【24h】

Reducing product cycle time in semiconductor assembly: Market Pressures and Strategy for Success

机译:减少半导体装配中的产品循环时间:成功的市场压力和战略

获取原文

摘要

The semiconductor market is cyclical and evolves to meet changing market conditions. Demand for any one product is unpredictable, and product life cycles continue to shorten. "Test, Assembly and Packaging" (TAP) manufacturers must meet the challenge to stay profitable in this market.
机译:半导体市场是周期性的,也是发展来满足不断变化的市场状况。对任何一个产品的需求是不可预测的,产品寿命周期继续缩短。 “测试,装配和包装”(Tap)制造商必须符合该市场保持盈利的挑战。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号