Development of New Low Temperature and Low Pressure Molding Including Gel Coat System

摘要

The new molding process for low temperature and low pressure sheet molding compound (LTLP-SMC) has been developed. In this process, gel coat system can be introduced like open molding process. LTLP molding process will be very good alternative for hand lay up (HLU), spray up (SU), resin transfer molding (RTM) and resin injection (RI). But it has not been accepted for many applications yet, because it was so difficult to mold perfectly pinhole free products. Even a few pinhole may result in paint popping, therefore LTLP molding could not be applied for the applications to be painted. Vacuum molding is one of the solutions, but it needs expensive tooling and molding system. It can not be a good solution because a heavy investment is not acceptable for LTLP process. New LTLP system with gel coat has been developed as a realistic solution. With the new system, pinhole free parts are easily available. Gel coat can be used not only as finished surface but also as primer. Moreover HLU, SU, RTM and RI molders can get very clean working environment and short cycle time with LTLP process. And the new system is very cost effective, too.