This paper details the building of a finite element mesh tailored to the simulation of a complete nano-imprint lithography process. In earlier work, a method based on finite elements was used to simulate both the cool-down phase and the stamp release of nano-imprinted structures [1]. This model accounted for the thermo-viscoelastic behaviour of the resist, the adhesion between the stamp and the resist, and the dynamics of the process. It could be connected to another model describing the embossing of the polymer at a temperature far above the glass transition of the resist by means of a fluid-solid interaction solver [2] to reflect a full process, as shown in functional pathway A, Fig. 1.
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