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^4fEvaluation of DAVED - Microgyros Realized with a new 50 μ SOI - Based Technology

机译:^ 4达到的微晕 - 微晕术利用新的50μSOI技术实现

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^7fThis paper reports on a new low cost, SOI-based technology, developed at HSG-IMIT, with a thickness of the device layer of about 50 μm and a low pressure encapsulation. The necessity of the development of the advanced technology process is pointed out by the example of the micro-machined gyroscopes DAVED-LL. The individual steps of the process flow and results characterizing the technology are described and discussed in detail. First measurement results of gyroscopes realized with the advanced technology are presented and a comparison with the technical data of DAVED-LL sensors with a device layer thickness of 15 μm is accomplished.
机译:^ 7FTHIS关于新的低成本,基于SOI的技术的报告,在HSG-IMIT开发,厚度为约50μm和低压封装。通过微机器陀螺仪Daved-L1的示例指出了先进技术过程的发展的必要性。详细描述并详细讨论了处理该技术的过程流程的各个步骤和表征技术的结果。提出了利用先进技术实现的陀螺仪的第一测量结果,完成了与设备层厚度为15μm的Daved-LL传感器的技术数据的比较。

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