Epoxy molding compounds are frequently used as encapsulants in microelectronic packages. The tendency of epoxy molding compounds (and other polymers) to display time-dependent behavior that may be strongly influenced by temperature and byabsorbed moisture requires the development sophisticated constitutive models if realistic analyses of the mechanical performance and reliability of electronic packages are to be performed. This paper presents a summary of the results obtained at OhioState University in an ongoing effort to characterize the effects of temperature and moisture upon the mechanical behavior of epoxy molding compounds.
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