One of the fundamental cooling issues for any type of electronic packages is the basic component coolability involving manufacturing, material and packaging constraints. Electronic modules have evolved over the years due to changing functionalrequirements and lately due to costs. Changes over the years have always been in the direction of increased power dissipation and corresponding improvements in coolability. This paper reviews the current single chip module (SCM) coolability analysis aswell as multichip module (MCM) coolability designs. A comparison of standard SCM designs with thermally enhanced designs will also be presented. Various MCM thermal designs, ranging from thermal conduction, liquid encapsulation and modular jet impingement will be presented to illustrate the pros and cons of each design with an emphasis on comparative performance in terms of MCM coolability.
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