Failure analysis of brittle components in electronic packaging

摘要

A procedure has been developed to predict the structural integrity of brittle components when subjected to manufacturing and environmental loads. The procedure is demonstrated on gallium arsenide (GaAs) which is commonly used in microwavemodules. The material was characterized by Weibull statistics from four point bend test data. The stresses in the GaAs component was generated from a detail finite element model of the GaAs device, attach material and the base material in the microwavehousing. A two parameter Weibull analysis is applied to the GaAs device. A study of the influence of mesh density on the probability of survival (POS) indicates a lack of convergence in the stress field near the free surface of the multi-materialinterface. The increased mesh density had an insignificant impact of the POS calculation.