A PREVENTION METHOD OF BRITTLE FRACTURE FOR A PACKAGE FABRICATED BY JOINING AN ELECTRONIC COMPONENT FINISHED WITH NICKEL AND ANOTHER ELECTRONIC COMPONENT FINISHED WITH ELECTROLESS NI(P) METALLIZATION

摘要

The present invention relates, generally, to methods for joining an electronic part finished with nickel and an electronic part finished with electroless nickel, which can prevent a brittle fracture, more particularly, to a method for joining an electronic part finished with nickel and an electronic part finished with electroless nickel with a solder by controlling the composition of the solder to prevent a brittle fracture occurring at the solder joining portion. A method for joining an electronic part finished with nickel and an electronic part finished with electroless nickel, comprising: (1) reflowing solder to a nickel portion of an electronic part finished with nickel to obtain an electronic part where an intermetallic compound and a solder are formed; (2) obtaining an electronic part finished with an eletroless nickel, of which the nickel portion is connected with the solder; and (3) solder-joining an electronic part finished with nickel obtained in the step (1) and the electronic part finished with electroless nickel obtained in the step (2).