Reversible Interconnection-An Approach to Debonding Joined Materials at the Bonded Interface

摘要

Making a separating of the each materials at the bonded interface easy is an important problem from the viewpoint of environment. An approach to debonding joined materials at the bonded interface is described in this paper. A realizing of the reversible interconnection is achieved by control of reactions at the interface. "Direct bonding" is carried out by using the surface activated bonding method. "Separating" is carried out by heating. A structure of the bonded interface is changed to a brittle layer by heating and the bonding strength of the interface is weakened. The concept of the reversible interconnection is demonstrated for the case of Al-austenitic stainless steel system.