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Thermal management of sealed electronic enclosures using synthetic technology

机译:用合成技术热管理密封电子外壳

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Sealed electronic enclosures are becoming more common in the electronics industry and are difficult to cool with air because an external air supply is not permissible. Furthermore, cooling schemes that employ alternative fluids may be tooexpensive for many consumer electronics applications. This paper reports the results of an experiment to demonstrate that synthetic jet technology can provide improved air circulation within a sealed electronic enclosure and can thereby reduce theoperating temperature of installed electronic components.A model of a sealed electronic enclosure was constructed and a 2.54 cm×2.54 cm Kapton heater, energized to 0.85 W, was installed on the center of one inside surface of the enclosure. A synthetic jet actuator with an 0.16-cm diameter orifice was used tocreate a jet of air that impinged normal to the heater surface. With the synthetic jet off and the heater energized, steady-state conditions were attained alter about 1500 seconds, and the heater reached a temperature of approximately 56°C with an ambient temperature of 23°C. After the synthetic jet was powered, a new steady-state condition was reached within 900 seconds, and the heater temperature decreased 14°C to value of about 42°C. Thus, the temperature rise above ambient was reduced by more than 40percent with the synthetic jet operating.
机译:密封电子罩在电子行业中变得越来越普遍,并且由于不允许外部供气而难以冷却空气。此外,用于许多消费电子应用的冷却方案对于许多消费电子应用可能太高。本文报告了实验结果表明,合成射流技术可以在密封的电子外壳内提供改进的空气循环,从而可以降低安装的电子元件的特工温度。构造了密封电子外壳的模型,并为2.54厘米×2.54 CM Kapton加热器,通电到0.85 W,安装在机箱内表面的一个内部。使用具有0.16厘米直径的孔口的合成射流致动器以将射流冲到加热器表面的空气喷射。随着合成射流关闭和加热器通电,稳态条件达到约1500秒,加热器达到约56℃的温度,环境温度为23℃。在合成射流供电后,在900秒内达到新的稳态条件,加热器温度降低14℃至约42℃。因此,与合成喷射操作相比,高于环境温度的温度升高超过40。

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