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Research Challenges and Directions in the Next-Generation Packaging From the Telecommunications Perspective

机译:从电信角度的下一代包装中的研究挑战和方向

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One important consequence of sub-micron siicon technology is that many telecommunications products can now be realized at relatively low cost and using only a few chips. It is one of the most rapidly growing segments of the semiconductor business and the effects can be seen both in mixed-mode RF functions and in the digital integrate circuitry that forms the core of most advanced telecom products.
机译:Simon Siicon技术的一个重要后果是,现在可以以相对较低的成本实现许多电信产品,只使用几个芯片。它是半导体业务中最迅速增长的段之一,并且可以在混合模式RF功能中看到效果,并在形成最先进的电信产品的核心的数字集成电路中。

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