We propose a design and technology methodology and CAD tools for a microsystems fabrication based on the 1.0μm CMOS from ATMEL-E52. In order to profit from vendor cell libraries, design kits have to be enhanced to deal with the new conception environment Main contributions are, sensor dependent technology file, device modeling and automatic generation for different ranges, and adaptation of semi-custom tools (simulation environment and P&R) for complete microsystems design. A library of dedicated sensor cells is being designed using Cadence DFWII and the foundry design kit These sensors are fabricated with the standard CMOS process plus some post-processing steps. Three levels of post-processing are considered: (1) pH-ISFET sensors fabricated using standard CMOS, (2) gas flow and radiation sensors based on thermopiles using simple post-processing (maskless anisotropic etching), (3) piezoresistive pressure and acceleration sensors with complete post-processing, (double-sided photolithography and silicon anisotropic etching). The post-processing is compatible with the foundry CMOS process. Our technology has been developed up to the point of maximum simplification that results in the use of only one additional mask for back-side etching (membrane mask). Passivation layer together with oxide windows are used for front-side etching with excellent results.
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