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Verification of layout efficient shield-based de-embedding techniques for on-wafer HBT characterisation up to 30 GHz

机译:验证布局高效的基于屏蔽的去嵌入技术,用于晶圆上的晶圆HBT表征高达30 GHz

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On-wafer measurements play a vital role in device characterization and modelling for advanced high speed devices such as SiGe HBTs and submicron MOSFETs. Unfortunately, due to the lossy nature of Si substrates, extensive, area hungry, de-embedding structures are necessary to separate the intrinsic device characteristics from the extrinsic parasitics. It has been postulated that the use of shield-based structures may lead to a reduction in the layout-area requirements for de-embedding structures. In this work, we show for the first time that shielding techniques do indeed provide an area saving as high as 40% for the HBT process considered here.
机译:晶圆测量在设备表征和适用于SiGe HBT和亚微米MOSFET等先进的高速设备中起着重要作用。遗憾的是,由于Si基板的损失,广泛的区域饥饿,脱嵌结构是将内在装置特征与外在诱导剂分离的必要条件。已经假设了屏蔽基结构的使用可能导致降低除嵌入结构的布局面积要求。在这项工作中,我们首次展示屏蔽技术确实为这里考虑的HBT过程提供了高达40%的区域。

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