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CHARACTERIZATION OF SILICON OXIDE-BASED MATERIALS IN AN ATOMIC FORCE MICROSCOPE

机译:原子力显微镜中氧化硅基材料的表征

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Silicon oxides are widespread in microelectronics and microelec-tromechanical systems (MEMS) applications. One form of this material that has been suggested as a dielectric in MEMS applications is a carbon-doped form of silicon oxide that can be produced in thin coatings. However, the mechanical properties and wear resistance of these coatings is unknown, and coatings of interest are difficult to characterize because they are very thin. A test methodology has been previously described using extremely sharp diamond tips on a stainless steel cantilever in an atomic force microscope, and this method allows direct calculation of an effective material flow strength at penetration depths as small as twenty nanometers. A number of forms of carbon-doped and undoped silicon dioxide have been evaluated using this methodology. Size effects on material properties are evaluated, and correlations between test methods are presented.
机译:硅氧化物在微电子和微量电力机械系统(MEMS)应用中是广泛的。 已经提出的这种材料的一种形式作为MEMS应用中的电介质是一种碳掺杂形式的氧化硅,其可以在薄涂层中制造。 然而,这些涂层的机械性能和耐磨性是未知的,并且感兴趣的涂层难以表征,因为它们非常薄。 先前已经使用原子力显微镜中的不锈钢悬臂上的极锋金刚型尖端描述了测试方法,并且该方法允许在渗透深度下直接计算小于20纳米的渗透深度。 已经使用该方法评估了许多形式的碳掺杂和未掺杂的二氧化硅。 评估对材料性质的尺寸效果,并提出了测试方法之间的相关性。

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