Two-phase cooling of VLSI chips with microjet heat sinkspromises a new, effective heat removal method. Microjet arrayscan achieve improved temperature uniformity in the presence ofchip hotspots. This paper describes the development and assessesthe performance of micromachined single and multi-jet arrayswith orifice diameters less than 100 μm. The devices were testedin a confined geometry with a dedicated heater test chip, as wellas in an open geometry with a standard 1 cm2 Intel test chip. Inthe confined geometry, a 76 μm diameter four-jet array at a flowrate of 8 ml/min removed over 90 W/cm2. Experimentalcomparisons of microjet and microchannel performance show thatmicrojets have improved thermal uniformity, offer a significantlymore stable two-phase region, and do not exhibit superheating.These advantages suggest that microjet arrays are the preferredmicro heat sinks for effective device cooling.
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机译：VLSI芯片两相冷却，微目一步散热池散装新的有效的除热法。 Microjet ArrayScan在存在的Hotpots的存在下实现了改善的温度均匀性。本文介绍了小于100μm的微机械单和多喷射阵列直径的显影和评估。通过专用加热器测试芯片测试设备，该设备被视为狭窄的几何形状，在具有标准1cm2英特尔测试芯片的开放几何形状中为云。 Inthe狭窄的几何形状，在8ml / min的流量下的76μm直径的四喷射阵列超过90w / cm 2。微目亡和微通道性能的实验组分离表明，Microbrojets具有改善的热均匀性，提供了一个稳定的两相区域，并且不表现出过热。这些优点表明微目型阵列是优选的散热器，用于有效的设备冷却。
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