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IMPINGING JET MANIFOLD FOR CHIP COOLING NEAR EDGE JETS
IMPINGING JET MANIFOLD FOR CHIP COOLING NEAR EDGE JETS
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机译:在边缘喷射附近芯片冷却喷射歧管
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摘要
Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.
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