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Experimental investigations in laser microsoldering

机译:激光微渗透的实验研究

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Up to now, lasers have been well established in the field of materials processing for cutting, welding, and surface treatments. Recently, lasers in the medium power range have been of increasing interest in the production of electronic components. Higher integration density of electronic circuits demands improved mounting technology. Due to the reduced contact area of modern surface mounted packages, more sophisticated soldering systems are required to ensure product quality. Standard reflow soldering techniques may damage thermally sensitive devices, and mechanical tensions in the solder joints will occur, due to different thermal expansion coefficients. These problems can be avoided using a laser, as the amount of heat induced into the component is very small. Another advantage is the step-wise heat input resulting in a minimal overall thermal loading of the device and the possibility to control individually the heatflow for each solderjoint. In some applications lasers are the only reasonable tool, e.g., repairing printed circuit boards (PCB) produced in surface mounting technology or soldering of three dimensional PCBs. To improve quality and productivity of laser soldering tools, the time required for melting and wetting has to be minimized in the same manner as defective solder joints should be detected online. There are some commercial laser soldering systems available, using different types of process control, e.g., pyrometrical temperature measurement, detection of the reflected laser beam energy, or evaluating the sound emission while melting the solder with a pulsed laser. To obtain certain time-temperature curves, an analogous regulation of the beam power is required. Therefore a pyrometer offers the best approach to get optimal thermal input, even if the measurement is difficult due to complex geometry and unknown emissivity of the surface. This paper outlines the behavior of the solder paste under irradiation of different wavelengths and the possibility of controlling the solder process via the above mentioned setup.
机译:到现在为止,激光器已经被很好地建立在材料进行切割加工,焊接和表面处理领域。近日,在中等功率范围的激光器已经在生产电子元件的越来越大的兴趣。电子电路要求更高的集成度提高安装技术。由于现代表面的接触面积减小安装包,需要更复杂的焊接系统,以确保产品质量。标准回流焊接技术可能会损坏热敏感设备,并且在焊点机械张力将发生,由于不同的热膨胀系数。可以使用激光来避免这些问题,如热致成成分的量非常小。另一个优点是导致装置和单独地控制每个solderjoint的热流的可能性的最小的总热负荷逐步热输入。在一些应用中的激光器的唯一合理工具,在表面安装技术或三维多氯联苯焊接产生例如,修复的印刷电路板(PCB)。为了提高激光焊接工具的质量和生产率,用于熔化和润湿已经以相同的方式被最小化为有缺陷的焊点应在线检测所需的时间。有一些商业激光焊接系统可用的,使用不同类型的过程控制,例如,pyrometrical温度测量,检测反射的激光束的能量,或评估声音发射而熔化用脉冲激光的焊料的。为了获得一定的时间 - 温度曲线,需要光束功率的类似的调节。因此,高温计提供了最好的方法以获得最佳的热输入,即使测量是复杂的几何形状和表面的辐射未知困难的,因为。本文概述了焊膏的不同波长的照射下的行为和控制经由上述的设置的焊接工艺的可能性。

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