Microsoldering and Microminiature Welding with Lasers.

摘要

Miniature welding of electronic and electromechanical components with lasers is a rapidly maturing technology. Extending the use of lasers to microsoldering and microminiature welding applications has also generated moderate interest. Use of lasers for microminiature soldering or welding permits the delivery of accurately controlled amounts of heat to the precise area required. By applying small amounts of heat locally, rework can be accomplished in densely packed circuits without damaging heat sensitive components to conductors. Also, localization of heat obviates the need for using solder alloys of different melting points, which can simplify design. Laser soldering has been applied to conductors ranging from 25 mu m dia. wires to coaxial cables in the 0.3 to 1.25 mm range. For the most part, these conductors were soldered to metallized alumina substrates, although in some instances soft substrates were also used. The potential advantages of microminiature welding have also been explored. 9 refs., 6 figs., 1 tab. (ERA citation 13:049128)