Repairing bonding wire connections using a microsoldering unit inside an SEM

摘要

We have investigated a new method to repair a broken bonding wire on a semiconductor device inside a Scanning Electron Microscope (SEM). This approach makes use of a microsoldering unit that is mounted on a micromanipulator and can be heated up to 200 ℃ and a small heating stage on which a sample is mounted. A microgripper is used to bring the broken bonding wire to its original place and a special solder is used to make a low ohmic connection between the broken contacts.