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Experimental investigations in laser microsoldering

机译:激光微焊的实验研究

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Abstract: Up to now, lasers have been well established in the field of materials processing for cutting, welding, and surface treatments. Recently, lasers in the medium power range have been of increasing interest in the production of electronic components. Higher integration density of electronic circuits demands improved mounting technology. Due to the reduced contact area of modern surface mounted packages, more sophisticated soldering systems are required to ensure product quality. Standard reflow soldering techniques may damage thermally sensitive devices, and mechanical tensions in the solder joints will occur, due to different thermal expansion coefficients. These problems can be avoided using a laser, as the amount of heat induced into the component is very small. Another advantage is the step-wise heat input resulting in a minimal overall thermal loading of the device and the possibility to control individually the heatflow for each solderjoint. In some applications lasers are the only reasonable tool, e.g., repairing printed circuit boards (PCB) produced in surface mounting technology or soldering of three dimensional PCBs. To improve quality and productivity of laser soldering tools, the time required for melting and wetting has to be minimized in the same manner as defective solder joints should be detected online. There are some commercial laser soldering systems available, using different types of process control, e.g., pyrometrical temperature measurement, detection of the reflected laser beam energy, or evaluating the sound emission while melting the solder with a pulsed laser. To obtain certain time-temperature curves, an analogous regulation of the beam power is required. Therefore a pyrometer offers the best approach to get optimal thermal input, even if the measurement is difficult due to complex geometry and unknown emissivity of the surface. This paper outlines the behavior of the solder paste under irradiation of different wavelengths and the possibility of controlling the solder process via the above mentioned setup.!18
机译:摘要:到目前为止,激光在切割,焊接和表面处理的材料加工领域已经确立了良好的地位。近来,中等功率范围的激光器在电子部件的生产中已引起越来越多的关注。电子电路的更高集成密度要求改进的安装技术。由于减小了现代表面贴装封装的接触面积,因此需要更先进的焊接系统以确保产品质量。标准的回流焊接技术可能会损坏热敏设备,并且由于不同的热膨胀系数,会在焊点中产生机械张力。使用激光可以避免这些问题,因为感应到组件中的热量非常小。另一个优点是逐步输入热量,从而使设备的整体总热负荷最小,并且可以单独控制每个焊点的热流。在某些应用中,激光是唯一合理的工具,例如,修复以表面安装技术生产的印刷电路板(PCB)或三维PCB的焊接。为了提高激光焊接工具的质量和生产率,熔化和润湿所需的时间必须最小化,就像在线检测缺陷焊点一样。有一些商用激光焊接系统可用,它们使用不同类型的过程控制,例如高温测量温度,检测反射的激光束能量或评估声发射,同时用脉冲激光熔化焊料。为了获得某些时间-温度曲线,需要对射束功率进行类似的调节。因此,即使由于复杂的几何形状和未知的表面发射率而导致测量困难,高温计仍可提供获得最佳热输入的最佳方法。本文概述了焊膏在不同波长的照射下的行为以及通过上述设置控制焊锡过程的可能性。18

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