Calibrating Teledyne-e2v's ultraviolet image sensor quantum efficiency processes

摘要

Teledyne-c2v's sensors and wafer-scale processing arc widely used for high performance imaging across soft X-ray and optical bands. In the ultraviolet spectral range, the combination of short absorption lengths (below 10 nm) and high reflectance (up to 75 %) can strongly limit the quantum efficiency. Direct detection capability relies on back-illumination and back-thinning processes to be applied to a sensor to remove dead layers from the optical path. As the thinning process leaves an unacceptably thick backside potential well as well as a highly reflective surface, in-house ultraviolet-specific (e.g. for WUVS) or third-party processes (e.g. delta-doping for FIREBall) arc required. We have calibrated Tclcdync-e2v's latest in-house wafer-scale proprietary processes with monochromatic synchrotron radiation over a wide spectral range in the ultraviolet domain (A=40 nm - 400 nm) at the Metrology Light Source of the Physikalisch-Technische Bundesanstalt. The first process is a shallow p+ implantation that permits the thinning of the backside potential well. It is available in two different levels: basic and enhanced. The second type of enhancement is a specific anti-reflective coating to increase the back-surface transmittance for distinct spectral ranges. In this paper, we will present comparative quantum efficiency calibration of both passivation stages and of two different ultraviolet specific anti-reflective coatings (applied on enhanced passivation devices). Also, their stability after intense ultraviolet illumination will be shown. These measurements will permit Teledync-e2v to extend the quantum efficiency data of their most recent processes across the soft X-ray to near-infrared spectrum.