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Simulation of the Influence of High-Voltage Pulsed Potential Supplied During the Deposition on the Structure and Properties of the Vacuum-Arc Nitride Coatings

机译:沉积在真空氮化物涂层的结构和性能下高压脉冲电位的影响

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TiN films have been deposited on stainless steel plates using plasma based the ion implantation & deposition (PBII&D) with a negative pulse voltage from 850 to 2000 V. According to the results of X-ray structural analysis, the formation of titanium nitride with a cubic crystal lattice of the NaCl structural type is seen to occur. Computer simulation allows determining the depth of the layer that is exposed to the radiation, taking into account all the cascade damage. The depth of the layer varies from 3 to 4.4 nm with an increase of negative impulse potential (Uip) from 850 to 2000 V, respectively. A transition of the texture from to is present in TiN coatings with an increase of Uip. In the case of a pulse duration of 10 and 16 μs in the entire range of Uip used, the following dependences are observed: with the increasing Uip, the deformation of the crystallite lattice decreases with the axis of the texture and increases with the corresponding deformation in the crystallite with the axis of the texture.
机译:使用等离子体基于离子注入和沉积(PBII&D)的离子注入和沉积(PBII&D)沉积在不锈钢板上,其中负脉冲电压为850至2000V。根据X射线结构分析的结果,形成氮化钛用立方体看到NACL结构类型的晶格发生。考虑到所有级联损坏,计算机仿真允许确定暴露于辐射的层的深度。层的深度在850至2000V的较大负脉冲电位(UIP)增加到4至4.4nm。纹理从锡涂层中的过渡,随着UIP的增加。在所用UIP的整个UIP范围内的脉冲持续时间为10和16μs的情况下,观察到以下依赖性:随着UIP的增加,结晶石物晶格的变形随纹理的轴线而减小,并随着相应的变形而增加在具有纹理轴的微晶中。

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